Besi
From Wikipedia the free encyclopedia
 | |
| Besi | |
| Company type | Public |
| |
| ISIN | NL0012866412 |
| Industry | Semiconductors |
| Founded | 1995 |
| Founders | Richard Blickman (CEO since 1995) |
| Headquarters | Duiven , The Netherlands |
Area served | Worldwide |
| Revenue | €592.8 million (2017) |
Number of employees | 1819 (2022) |
| Website | https://besi.com |
BE Semiconductor Industries N.V., simply called Besi, is a Dutch multinational company that designs and manufacturers semiconductor equipment.[1][2] Besi offers die attach, packaging, and plating solutions.
History[edit]
The company was founded in May, 1995 by Richard Blickman, who still leads the company today. At the end of 2022, Besi had a total of 1,675 permanent and 144 temporary employees.[3] It outsources production to its subsidiaries in China and Malaysia.
Besi is a publicly traded company, and its shares are listed on the Euronext Amsterdam stock market under the BESI ticker symbol.[4][5] In 2021, Besi was valued at around $5.6 billion.[5]
Products[edit]
Besi offers die attach, packaging and plating solutions, with the die attach segment making up 82 % of the revenue in 2021.[6] The segment includes Flip Chip, Hybrid Bonding as well as Thermo Compression products among others.[7][8][9] In total, Besi had a 42 % market share in the segment in 2022, making them the market leader.[10] The company's plating products on the other hand are used mainly for solar cells and connectors, as well as other electric devices.[11]
References[edit]
- ^ "BESI.AS - | Stock Price & Latest News | Reuters". www.reuters.com. Retrieved 2023-09-10.
- ^ "BESI:EN Amsterdam Stock Quote - BE Semiconductor Industries NV". Bloomberg.com. Retrieved 2017-06-15.
- ^ "Company Profile". Besi. Retrieved 2023-09-12.
- ^ "BE Semiconductor Industries NV: AMS:BESI quotes & news - Google Finance". www.google.com. Retrieved 2017-06-15.
- ^ a b "BE SEMICONDUCTOR | Euronext". www.euronext.com (in Dutch). Retrieved 2019-03-15.
- ^ "Advances in Interconnect and Assembly Technologies for Next Generation Electronic Systems" (PDF). inemi.org. Retrieved 2023-12-13.
- ^ "Advanced Packaging Part 3 – Intel's Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape". semianalysis.com. 2022-01-19. Retrieved 2023-12-13.
- ^ "Products & Technology". besi.com. Retrieved 2023-12-13.
- ^ "Besi holds the best cards in advanced packaging, but the game has only just begun". bits-chips.nl. 2023-11-01. Retrieved 2023-12-13.
- ^ "One Under-the-Radar Semiconductor Stock With 125% Upside, According to Wall Street". fool.com. 2022-10-24. Retrieved 2023-12-13.
- ^ "New Contact Plating Processes Cut Costs, Improve Environmental Impacts". connectorsupplier.com. 2022-03-01. Retrieved 2023-12-13.
