350 nm process

From Wikipedia the free encyclopedia

The 350 nanometer process (350 nm process) is a level of semiconductor process technology that was reached in the 1995–1996 timeframe by leading semiconductor companies like Intel and IBM.


Products featuring 350 nm manufacturing process[edit]


  1. ^ RIVA 128 gains support as preferred Direct3D developer platform press release, Nvidia, accessed December 3, 2023.
  2. ^ "Propeller I semiconductor process technology? Is it 350nm or 180nm?". Parallax Forums. Archived from the original on 2012-07-10. Retrieved 2015-09-13.
  3. ^ Petryk, Dmytro; Dyka, Zoya (2018). "Optical Fault Injections: a Setup Comparison". S2CID 198917285. {{cite journal}}: Cite journal requires |journal= (help)
  4. ^ Guillen, Oscar; Gruber, Michael; De Santis, Fabrizio (2017). "Low-Cost Setup for Localized Semi-invasive Optical Fault Injection Attacks: How Low Can We Go?". Constructive Side-Channel Analysis and Secure Design. Lecture Notes in Computer Science. Vol. 10348. pp. 207–222. doi:10.1007/978-3-319-64647-3_13. ISBN 978-3-319-64646-6.
Preceded by
600 nm
CMOS manufacturing processes Succeeded by
250 nm