LGA 1200

LGA 1200
Release dateMay 27, 2020 (2020-05-27)
Designed byIntel
Manufactured byFoxconn
TypeLGA-ZIF
Chip form factorsFlip-chip
Contacts1200
FSB protocolPCI Express
Processors
PredecessorLGA 1151
SuccessorLGA 1700
Memory supportDDR4
This article is part of the CPU socket series

LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.[1][2]

LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips.[3]

ASRock, Asus, Biostar, Gigabyte and MSI have confirmed their motherboards based on the Intel Z490 chipset support the 11th generation Intel Rocket Lake desktop CPUs.[4][5][6][7] Full PCIe 4.0 support is confirmed for selected brands. ASUS did not include support to PCIe 4.0 on M.2, hindering support for PCIe gen 4.0 NVMe SSDs.[8][9]

Heatsink

[edit]
Pads of an Intel Core i9-10900K

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.[10][11][12]

Comet Lake chipsets (400 series)

[edit]

Memory support configuration common for all chipsets:

  • Dual channel DDR4-2666 or DDR4-2933
H410 B460 H470 Q470 Z490 W480
Overclocking Thermal limits CPU overclocking is offered by ASRock, ASUS and MSI[13][14] No Yes No
Bus Interface DMI 3.0 x4
CPU support Comet Lake-S only[15][16] Comet Lake-S / Rocket Lake (a BIOS update is required)[16][17]
Memory support Up to 64 GB Up to 128 GB
Maximum DIMM slots 2 4
Maximum USB 2.0 ports 10 12 14
USB 3.2 ports configuration Gen 1x1 Up to 4 Up to 8 Up to 10
Gen 2x1 N/A Up to 4 Up to 6 Up to 8
Maximum SATA 3.0 ports 4 6 8
Processor PCI Express v3.0 configuration 1x16 1x16 or 2x8 or 1x8+2x4
PCH PCI Express configuration 6 16 20 24
Independent Display Support (digital ports/pipes) 2 3
Integrated Wireless (802.11ax) No Intel Wi-Fi 6 AX201[a]
SATA RAID 0/1/5/10 support No Yes
Intel Optane Memory Support
Intel Smart Sound Technology
Intel Active Management, Trusted Execution and vPro Technology No Yes No Yes
Chipset TDP 6W
Chipset lithography 22 nm[18] 14 nm[18]
Release date Q2 2020

Rocket Lake chipsets (500 series)

[edit]

Memory support configuration common for all chipsets (except W580):

  • Dual channel
  • DDR4-3200 for 11th generation Rocket Lake Core i9/i7/i5 CPUs
  • DDR4-2933 for 10th generation Comet Lake Core i9/i7 CPUs
  • DDR4-2666 for all other CPUs
  • Up to 128 GB using 32 GB modules; maximum 64 GB for the H510 chipset

W580 based motherboards support DDR4-3200 RAM in dual channel mode.

H510 B560 H570 Q570 Z590 W580
Overclocking No RAM only No Yes RAM only
Bus Interface DMI 3.0 x4 DMI 3.0 x8 (runs in x4 mode for Comet Lake-S CPUs)
CPU support Comet Lake-S / Rocket Lake Rocket Lake
Maximum DIMM slots 2 4
Maximum USB 2.0 ports 10 12 14
USB 3.2 ports configuration Gen 1x1 Up to 4 Up to 6 Up to 8 Up to 10 Up to 10
Gen 2 x1 — Up to 4 Up to 8
x2 Up to 2 Up to 3
Maximum SATA 3.0 ports 4 6 8
Processor PCI Express v4.0 configuration 1x16 1x16 + 1x4 1x16 + 1x4 or
2x8 + 1x4 or
1x8 + 3x4
PCH PCI Express configuration 6 12 20 24
Independent Display Support (digital ports/pipes) 2 3
Integrated Wireless (802.11ax) Intel Wi-Fi 6 AX201[a]
PCIe RAID 0/1/5/10 support No Yes
SATA RAID 0/1/5/10 support No Yes
Intel Optane Memory Support No Yes
Intel Smart Sound Technology
Intel Active Management, Trusted Execution and vPro Technology No Yes No Yes
Chipset TDP 6W
Chipset lithography 14 nm[citation needed]
Release date Q1 2021 Q2 2021 Q1 2021 Q2 2021
  1. ^ a b depends on OEM's implementation

See also

[edit]

References

[edit]
  1. ^ "Intel® Z490 Chipset Product Specifications". Intel. Retrieved April 30, 2020.
  2. ^ Bonshor, Gavin. "The Intel Z490 Overview: 44+ Motherboards Examined". AnandTech. Retrieved April 30, 2020.
  3. ^ Mujtaba, Hassan (November 1, 2019). "Intel's Entire 10th Gen Comet Lake Desktop CPU Lineup Leaked – Up To 10 Cores, 20 Thread Core i9-10900, 80W TDP, W480 Chipset With New LGA 1200 Socket". Wccftech. Retrieved November 30, 2019.
  4. ^ "Biostar and ASrock confirm 11th Gen Core 'Rocket Lake-S' support on Z490 motherboards". VideoCardz. December 26, 2020. Retrieved December 26, 2020.
  5. ^ "Gigabyte Says Intel Z490 Chipset Motherboards Will Support 11th Gen "Rocket Lake-S"". TechPowerUp. May 1, 2020. Retrieved February 21, 2021.
  6. ^ Campbell, Mark (January 7, 2021). "ASUS updates its Z490 motherboards with 11th Gen Intel CPU support". Overclock3D. Retrieved February 18, 2021.
  7. ^ Mujtaba, Hassan (December 29, 2020). "MSI Adds Intel Rocket Lake 11th Gen CPU Support on Z490 Motherboards". Wccftech. Retrieved February 18, 2021.
  8. ^ Mujtaba, Hassan (February 8, 2021). "ASUS Z490 Motherboards Tested With Intel Rocket Lake Desktop CPU, Lack PCIe Gen 4.0 Support on M.2 Slots". Wccftech. Retrieved February 18, 2021.
  9. ^ Mujtaba, Hassan (July 3, 2020). "ASUS Z490 Motherboards Severely Lack Behind In PCIe 4.0 Support Compared To Competitors, No Proper Hardware-Level Integration For Rocket Lake CPUs". Wccftech. Retrieved February 18, 2021.
  10. ^ Bonshor, Gavin (April 30, 2020). "The Intel Z490 Overview: 44+ Motherboards Examined". AnandTech. Retrieved May 1, 2020.
  11. ^ "ID-COOLINGFrostflow 240-R】ID-COOLING FROSTFLOW 240-R 红色灯效经典款一体式水冷散热器 240冷排全平台扣具含115X/2066/AM4【行情 报价 价格 评测】-京东". item.jd.com. Retrieved December 26, 2019.
  12. ^ "ID-COOLINGSE-214pro红黑版】ID-COOLING SE-214i 热管镀镍版塔式侧吹CPU散热器 四热管12cm温控静音减震红灯风扇【行情 报价 价格 评测】-京东". item.jd.com. Retrieved December 26, 2019.
  13. ^ AleksandarK (May 1, 2020). "ASRock Enables Overclocking on Non-Z Motherboards for 10th Generation Non-K Comet Lake CPUs". TechPowerUp. Retrieved November 12, 2022.
  14. ^ "ASUS, ASRock and MSI bring 'overclocking' to H470/B460 and non-K Intel Core CPUs". VideoCardz. May 28, 2020. Retrieved November 12, 2022.
  15. ^ Cutress, Ian (January 11, 2021). "Intel Previews 11th Gen Core Rocket Lake: Core i9-11900K and Z590, Coming Q1". AnandTech. Retrieved February 11, 2021.
  16. ^ a b "BIOS Updates for Intel® 400 Series Chipset and Upcoming 11th Gen Intel® Core™ Desktop Processor-Based System Builds". Intel. Retrieved February 11, 2021.
  17. ^ "Intel® W480 Chipset Compatible Products". Intel. Retrieved July 27, 2023.
  18. ^ a b "Intel B460 and H410 Incompatibility with "Rocket Lake" Explained". TechPowerUp. February 10, 2021. Retrieved February 11, 2021.
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