List of AMD processors with 3D graphics

From Wikipedia the free encyclopedia

This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series.

Features overview[edit]

The following table shows features of AMD's processors with 3D graphics, including APUs.

Platform High, standard and low power Low and ultra-low power
Codename Server Basic Toronto
Micro Kyoto
Desktop Performance Raphael Phoenix
Mainstream Llano Trinity Richland Kaveri Kaveri Refresh (Godavari) Carrizo Bristol Ridge Raven Ridge Picasso Renoir Cezanne
Entry
Basic Kabini Dalí
Mobile Performance Renoir Cezanne Rembrandt Dragon Range
Mainstream Llano Trinity Richland Kaveri Carrizo Bristol Ridge Raven Ridge Picasso Renoir
Lucienne
Cezanne
Barceló
Phoenix
Entry Dalí Mendocino
Basic Desna, Ontario, Zacate Kabini, Temash Beema, Mullins Carrizo-L Stoney Ridge Pollock
Embedded Trinity Bald Eagle Merlin Falcon,
Brown Falcon
Great Horned Owl Grey Hawk Ontario, Zacate Kabini Steppe Eagle, Crowned Eagle,
LX-Family
Prairie Falcon Banded Kestrel River Hawk
Released Aug 2011 Oct 2012 Jun 2013 Jan 2014 2015 Jun 2015 Jun 2016 Oct 2017 Jan 2019 Mar 2020 Jan 2021 Jan 2022 Sep 2022 Jan 2023 Jan 2011 May 2013 Apr 2014 May 2015 Feb 2016 Apr 2019 Jul 2020 Jun 2022 Nov 2022
CPU microarchitecture K10 Piledriver Steamroller Excavator "Excavator+"[1] Zen Zen+ Zen 2 Zen 3 Zen 3+ Zen 4 Bobcat Jaguar Puma Puma+[2] "Excavator+" Zen Zen+ "Zen 2+"
ISA x86-64 v1 x86-64 v2 x86-64 v3 x86-64 v4 x86-64 v1 x86-64 v2 x86-64 v3
Socket Desktop Performance AM5
Mainstream AM4
Entry FM1 FM2 FM2+ FM2+[a], AM4 AM4
Basic AM1 FP5
Other FS1 FS1+, FP2 FP3 FP4 FP5 FP6 FP7 FL1 FP7
FP7r2
FP8
? FT1 FT3 FT3b FP4 FP5 FT5 FP5 FT6
PCI Express version 2.0 3.0 4.0 5.0 4.0 2.0 3.0
CXL
Fab. (nm) GF 32SHP
(HKMG SOI)
GF 28SHP
(HKMG bulk)
GF 14LPP
(FinFET bulk)
GF 12LP
(FinFET bulk)
TSMC N7
(FinFET bulk)
TSMC N6
(FinFET bulk)
CCD: TSMC N5
(FinFET bulk)

cIOD: TSMC N6
(FinFET bulk)
TSMC 4nm
(FinFET bulk)
TSMC N40
(bulk)
TSMC N28
(HKMG bulk)
GF 28SHP
(HKMG bulk)
GF 14LPP
(FinFET bulk)
GF 12LP
(FinFET bulk)
TSMC N6
(FinFET bulk)
Die area (mm2) 228 246 245 245 250 210[3] 156 180 210 CCD: (2x) 70
cIOD: 122
178 75 (+ 28 FCH) 107 ? 125 149 ~100
Min TDP (W) 35 17 12 10 15 65 35 4.5 4 3.95 10 6 12 8
Max APU TDP (W) 100 95 65 45 170 54 18 25 6 54 15
Max stock APU base clock (GHz) 3 3.8 4.1 4.1 3.7 3.8 3.6 3.7 3.8 4.0 3.3 4.7 4.3 1.75 2.2 2 2.2 3.2 2.6 1.2 3.35 2.8
Max APUs per node[b] 1 1
Max core dies per CPU 1 2 1 1
Max CCX per core die 1 2 1 1
Max cores per CCX 4 8 2 4 2 4
Max CPU[c] cores per APU 4 8 16 8 2 4 2 4
Max threads per CPU core 1 2 1 2
Integer pipeline structure 3+3 2+2 4+2 4+2+1 1+3+3+1+2 1+1+1+1 2+2 4+2 4+2+1
i386, i486, i586, CMOV, NOPL, i686, PAE, NX bit, CMPXCHG16B, AMD-V, RVI, ABM, and 64-bit LAHF/SAHF Yes Yes
IOMMU[d] v2 v1 v2
BMI1, AES-NI, CLMUL, and F16C Yes Yes
MOVBE Yes
AVIC, BMI2, RDRAND, and MWAITX/MONITORX Yes
SME[e], TSME[e], ADX, SHA, RDSEED, SMAP, SMEP, XSAVEC, XSAVES, XRSTORS, CLFLUSHOPT, CLZERO, and PTE Coalescing Yes Yes
GMET, WBNOINVD, CLWB, QOS, PQE-BW, RDPID, RDPRU, and MCOMMIT Yes Yes
MPK, VAES Yes
SGX
FPUs per core 1 0.5 1 1 0.5 1
Pipes per FPU 2 2
FPU pipe width 128-bit 256-bit 80-bit 128-bit 256-bit
CPU instruction set SIMD level SSE4a[f] AVX AVX2 AVX-512 SSSE3 AVX AVX2
3DNow! 3DNow!+
PREFETCH/PREFETCHW Yes Yes
GFNI Yes
AMX
FMA4, LWP, TBM, and XOP Yes Yes
FMA3 Yes Yes
AMD XDNA Yes
L1 data cache per core (KiB) 64 16 32 32
L1 data cache associativity (ways) 2 4 8 8
L1 instruction caches per core 1 0.5 1 1 0.5 1
Max APU total L1 instruction cache (KiB) 256 128 192 256 512 256 64 128 96 128
L1 instruction cache associativity (ways) 2 3 4 8 2 3 4 8
L2 caches per core 1 0.5 1 1 0.5 1
Max APU total L2 cache (MiB) 4 2 4 16 1 2 1 2
L2 cache associativity (ways) 16 8 16 8
Max on--die L3 cache per CCX (MiB) 4 16 32 4
Max 3D V-Cache per CCD (MiB) 64
Max total in-CCD L3 cache per APU (MiB) 4 8 16 64 4
Max. total 3D V-Cache per APU (MiB) 64
Max. board L3 cache per APU (MiB)
Max total L3 cache per APU (MiB) 4 8 16 128 4
APU L3 cache associativity (ways) 16 16
L3 cache scheme Victim Victim
Max. L4 cache
Max stock DRAM support DDR3-1866 DDR3-2133 DDR3-2133, DDR4-2400 DDR4-2400 DDR4-2933 DDR4-3200, LPDDR4-4266 DDR5-4800, LPDDR5-6400 DDR5-5200 DDR5-5600, LPDDR5x-7500 DDR3L-1333 DDR3L-1600 DDR3L-1866 DDR3-1866, DDR4-2400 DDR4-2400 DDR4-1600 DDR4-3200 LPDDR5-5500
Max DRAM channels per APU 2 1 2 1 2
Max stock DRAM bandwidth (GB/s) per APU 29.866 34.132 38.400 46.932 68.256 102.400 83.200 120.000 10.666 12.800 14.933 19.200 38.400 12.800 51.200 88.000
GPU microarchitecture TeraScale 2 (VLIW5) TeraScale 3 (VLIW4) GCN 2nd gen GCN 3rd gen GCN 5th gen[4] RDNA 2 RDNA 3 TeraScale 2 (VLIW5) GCN 2nd gen GCN 3rd gen[4] GCN 5th gen RDNA 2
GPU instruction set TeraScale instruction set GCN instruction set RDNA instruction set TeraScale instruction set GCN instruction set RDNA instruction set
Max stock GPU base clock (MHz) 600 800 844 866 1108 1250 1400 2100 2400 400 538 600 ? 847 900 1200 600 1300 1900
Max stock GPU base GFLOPS[g] 480 614.4 648.1 886.7 1134.5 1760 1971.2 2150.4 3686.4 102.4 86 ? ? ? 345.6 460.8 230.4 1331.2 486.4
3D engine[h] Up to 400:20:8 Up to 384:24:6 Up to 512:32:8 Up to 704:44:16[5] Up to 512:32:8 768:48:8 128:8:4 80:8:4 128:8:4 Up to 192:12:8 Up to 192:12:4 192:12:4 Up to 512:?:? 128:?:?
IOMMUv1 IOMMUv2 IOMMUv1 ? IOMMUv2
Video decoder UVD 3.0 UVD 4.2 UVD 6.0 VCN 1.0[6] VCN 2.1[7] VCN 2.2[7] VCN 3.1 ? UVD 3.0 UVD 4.0 UVD 4.2 UVD 6.0 UVD 6.3 VCN 1.0 VCN 3.1
Video encoder VCE 1.0 VCE 2.0 VCE 3.1 VCE 2.0 VCE 3.1
AMD Fluid Motion No Yes No No Yes No
GPU power saving PowerPlay PowerTune PowerPlay PowerTune[8]
TrueAudio Yes[9] ? Yes
FreeSync 1
2
1
2
HDCP[i] ? 1.4 2.2 2.3 ? 1.4 2.2 2.3
PlayReady[i] 3.0 not yet 3.0 not yet
Supported displays[j] 2–3 2–4 3 3 (desktop)
4 (mobile, embedded)
4 2 3 4 4
/drm/radeon[k][11][12] Yes Yes
/drm/amdgpu[k][13] Yes[14] Yes[14]
  1. ^ For FM2+ Excavator models: A8-7680, A6-7480 & Athlon X4 845.
  2. ^ A PC would be one node.
  3. ^ An APU combines a CPU and a GPU. Both have cores.
  4. ^ Requires firmware support.
  5. ^ a b Requires firmware support.
  6. ^ No SSE4. No SSSE3.
  7. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  8. ^ Unified shaders : texture mapping units : render output units
  9. ^ a b To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup.
  10. ^ To feed more than two displays, the additional panels must have native DisplayPort support.[10] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed.
  11. ^ a b DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version.

Graphics API overview[edit]

The following table shows the graphics and compute APIs support across ATI/AMD GPU microarchitectures. Note that a branding series might include older generation chips.

Chip series Micro­architecture Fab Supported APIs AMD support Year introduced Introduced with
Rendering Computing / ROCm
Vulkan[15] OpenGL[16] Direct3D HSA OpenCL
Wonder Fixed-pipeline[a] 1000 nm
800 nm
Ended 1986 Graphics Solutions
Mach 800 nm
600 nm
1991 Mach8
3D Rage 500 nm 5.0 1996 3D Rage
Rage Pro 350 nm 1.1 6.0 1997 Rage Pro
Rage 128 250 nm 1.2 1998 Rage 128 GL/VR
R100 180 nm
150 nm
1.3 7.0 2000 Radeon
R200 Programmable
pixel & vertex
pipelines
150 nm 8.1 2001 Radeon 8500
R300 150 nm
130 nm
110 nm
2.0[b] 9.0
11 (FL 9_2)
2002 Radeon 9700
R420 130 nm
110 nm
9.0b
11 (FL 9_2)
2004 Radeon X800
R520 90 nm
80 nm
9.0c
11 (FL 9_3)
2005 Radeon X1800
R600 TeraScale 1 80 nm
65 nm
3.3 10.0
11 (FL 10_0)
ATI Stream 2007 Radeon HD 2900 XT
RV670 55 nm 10.1
11 (FL 10_1)
ATI Stream APP[17] Radeon HD 3850/3870
RV770 55 nm
40 nm
1.0 2008 Radeon HD 4850/4870
Evergreen TeraScale 2 40 nm 4.5
(Linux 4.2)
[18][19][20][c]
11 (FL 11_0) 1.2 2009 Radeon HD 5850/5870
Northern Islands TeraScale 2
TeraScale 3
2010 Radeon HD 6850/6870
Radeon HD 6950/6970
Southern Islands GCN 1st gen 28 nm 1.0 4.6 11 (FL 11_1)
12 (FL11_1)
Yes 1.2
2.0 possible
2012 Radeon HD 7950/7970
Sea Islands GCN 2nd gen 1.2 11 (FL 12_0)
12 (FL 12_0)
2.0
(1.2 in MacOS, Linux)
2.1 Beta in Linux ROCm
2.2 possible
2013 Radeon HD 7790
Volcanic Islands GCN 3rd gen 2014 Radeon R9 285
Arctic Islands GCN 4th gen 28 nm
14 nm
1.2

1.3 (GCN 4)

Supported 2016 Radeon RX 480
Polaris 2017 Radeon 520/530
Radeon RX 530/550/570/580
Vega GCN 5th gen 14 nm
7 nm
1.3 11 (FL 12_1)
12 (FL 12_1)
2017 Radeon Vega Frontier Edition
Navi RDNA 7 nm 2019 Radeon RX 5700 (XT)
Navi 2X RDNA 2 7 nm
6 nm
11 (FL 12_1)
12 (FL 12_2)
2020 Radeon RX 6800 (XT)
Navi 3X RDNA 3 6 nm
5 nm
2022 Radeon RX 7900 XT(X)
  1. ^ Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders.
  2. ^ These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures.
  3. ^ OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware.

[21][22][23]

Desktop processors with 3D graphics[edit]

APU or Radeon Graphics branded[edit]

Lynx: "Llano" (2011)[edit]

  • Socket FM1
  • CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache
  • GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.[24]
  • List of embedded GPU's
  • Support for up to four DIMMs of up to DDR3-1866 memory
  • Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors[25][26]
  • 5 GT/s UMI
  • Integrated PCIe 2.0 controller
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series
Model[note 1] Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
Cores
(threads)
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 198 2012 32 nm SOI LN-B0 2 (2) 2.5 64 KB inst.
64 KB data

per core
2×512 KB 1600 65 SD198XOJGXBOX SD198XOJZ22GX
Athlon II X2 221 2012 2.8 AD221XOJGXBOX AD221XOJZ22GX
Athlon II X4 631 2012 4 (4) 2.6 4×1 MB 1866 AD631XOJGXBOX AD631XOJZ43GX
Aug 15, 2011 100 AD631XOJGXBOX AD631XWNZ43GX
Athlon II X4 638 Feb 8, 2012 2.7 65 AD638XOJGXBOX AD638XOJZ43GX
Athlon II X4 641 Feb 8, 2012 2.8 100 AD641XWNGXBOX AD641XWNZ43GX
Athlon II X4 651 Nov 14, 2011 3.0 AD651XWNGXBOX AD651XWNZ43GX
Athlon II X4 651K 2012 AD651KWNGXBOX AD651KWNZ43GX
E2-3200 2011 2 (2) 2.4 2×512 KB HD 6370D 160:8:4 443 141.7 1600 65 ED3200OJGXBOX ED3200OJZ22GX
ED3200OJZ22HX
A4-3300 Sep 7, 2011 2.5 HD 6410D AD3300OJGXBOX
AD3300OJHXBOX
AD3300OJZ22GX
AD3300OJZ22HX
A4-3400 Sep 7, 2011 2.7 600 192 AD3400OJGXBOX
AD3400OJHXBOX
AD3400OJZ22GX
AD3400OJZ22HX
A4-3420 Dec 20, 2011 2.8 AD3420OJZ22HX
A6-3500 Aug 17, 2011 3 (3) 2.1 2.4 3×1 MB HD 6530D 320:16:8 443 283.5 1866 AD3500OJGXBOX AD3500OJZ33GX
A6-3600 Aug 17, 2011 4 (4) 4×1 MB AD3600OJGXBOX AD3600OJZ43GX
A6-3620 Dec 20, 2011 2.2 2.5 AD3620OJGXBOX AD3620OJZ43GX
A6-3650 Jun 30, 2011 2.6 100 AD3650WNGXBOX AD3650WNZ43GX
A6-3670K Dec 20, 2011 2.7 AD3670WNGXBOX AD3670WNZ43GX
A8-3800 Aug 17, 2011 2.4 2.7 HD 6550D 400:20:8 600 480 65 AD3800OJGXBOX AD3800OJZ43GX
A8-3820 Dec 20, 2011 2.5 2.8 AD3820OJGXBOX AD3820OJZ43GX
A8-3850 Jun 30, 2011 2.9 100 AD3850WNGXBOX AD3850WNZ43GX
A8-3870K Dec 20, 2011 3.0 AD3870WNGXBOX AD3870WNZ43GX
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Models with "K" suffixes feature an unlocked multiplier and overclockable GPU.

Virgo: "Trinity" (2012)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number[34]
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 240[35] 32 nm TN-A1 [1]2 2.9 3.3 64 KB inst.
per module

16 KB data
per core
1 MB 1600 65 SD240XOKA23HJ
Athlon X2 340[36] Oct 2012 3.2 3.6 AD340XOKA23HJ
Athlon X4 730 Oct 1, 2012 [2]4 2.8 3.2 2×2 MB 1866 AD730XOKA44HJ
Athlon X4 740 Oct 2012 3.2 3.7 AD740XOKHJBOX AD740XOKA44HJ
Athlon X4 750K 3.4 4.0 100 AD750KWOHJBOX AD750KWOA44HJ
FirePro A300 Aug 7, 2012 3.4 4.0 FirePro 384:24:8
6 CU
760 583.6 65 AWA300OKA44HJ
FirePro A320 3.8 4.2 800 614.4 100 AWA320WOA44HJ
A4-5300 Oct 1, 2012 [1]2 3.4 3.6 1 MB HD 7480D 128:8:4
2 CU
723 185 1600 65 AD5300OKHJBOX AD5300OKA23HJ
A4-5300B Oct 2012 AD530BOKA23HJ
A6-5400K Oct 1, 2012 3.6 3.8 HD 7540D 192:12:4
3 CU
760 291.8 1866 AD540KOKHJBOX AD540KOKA23HJ
A6-5400B Oct 2012 AD540BOKA23HJ
A8-5500 Oct 1, 2012 [2]4 3.2 3.7 2×2 MB HD 7560D 256:16:8
4 CU
760 389.1 AD5500OKHJBOX AD5500OKA44HJ
A8-5500B Oct 2012 AD550BOKA44HJ
A8-5600K Oct 1, 2012 3.6 3.9 100 AD560KWOHJBOX AD560KWOA44HJ
A10-5700 3.4 4.0 HD 7660D 384:24:8
6 CU
760 583.6 65 AD5700OKHJBOX AD5700OKA44HJ
A10-5800K 3.8 4.2 800 614.4 100 AD580KWOHJBOX AD580KWOA44HJ
A10-5800B Oct 2012 AD580BWOA44HJ
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Richland" (2013)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 250[35] 32 nm RL-A1 [1]2 3.2 3.6 64 KB inst.
per module

16 KB data
per core
1 MB 65 SD250XOKA23HL
Athlon X2 350[38] 3.5 3.9 1866 AD350XOKA23HL
Athlon X2 370K Jun 2013 4.0 4.2 AD370KOKHLBOX AD370KOKA23HL
Athlon X4 750 Oct 2013 [2]4 3.4 4.0 2×2 MB AD750XOKA44HL
Athlon X4 760K Jun 2013 3.8 4.1 100 AD760KWOHLBOX AD760KWOA44HL
FX-670K[39] Mar 2014 (OEM) 3.7 4.3 65 FD670KOKA44HL
A4-4000 May 2013 [1]2 3.0 3.2 1 MB HD 7480D 128:8:4
2 CU
720 184.3 1333 AD4000OKHLBOX AD4000OKA23HL
A4-4020 Jan 2014 3.2 3.4 AD4020OKHLBOX AD4020OKA23HL
A4-6300 Jul 2013 3.7 3.9 HD 8370D 760 194.5 1600 AD6300OKHLBOX AD6300OKA23HL
A4-6300B AD630BOKA23HL
A4-6320 Dec 2013 3.8 4.0 AD6320OKHLBOX AD6320OKA23HL
A4-6320B Mar 2014 AD632BOKA23HL
A4-7300 Aug 2014 HD 8470D 192:12:4
3 CU
800 307.2 AD7300OKA23HL
A4 Pro-7300B AD730BOKA23HL
A6-6400B Jun 4, 2013 3.9 4.1 1866 AD640BOKA23HL
A6-6400K AD640KOKHLBOX AD640KOKA23HL
A6-6420B Jan 2014 4.0 4.2 AD642BOKA23HL
A6-6420K AD642KOKHLBOX AD642KOKA23HL
A8-6500T Sep 18, 2013 [2]4 2.1 3.1 2×2 MB HD 8550D 256:16:8
4 CU
720 368.6 45 AD650TYHHLBOX AD650TYHA44HL
A8-6500 Jun 4, 2013 3.5 4.1 HD 8570D 800 409.6 65 AD6500OKHLBOX AD6500OKA44HL
A8-6500B AD650BOKA44HL
A8-6600K 3.9 4.2 844 432.1 100 AD660KWOHLBOX AD660KWOA44HL
A10-6700T Sep 18, 2013 2.5 3.5 HD 8650D 384:24:8
6 CU
720 552.9 45 AD670TYHHLBOX AD670TYHA44HL
A10-6700 Jun 4, 2013 3.7 4.3 HD 8670D 844 648.1 65 AD6700OKHLBOX AD6700OKA44HL
A10-6790B Oct 29, 2013 4.0 100 AD679KWOHLBOX AD679KWOA44HL
A10-6790K Oct 28, 2013 AD679BWOA44HL
A10-6800K Jun 4, 2013 4.1 4.4 2133 AD680KWOHLBOX AD680KWOA44HL
A10-6800B AD680BWOA44HL
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini" (2013, SoC)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
Cores
(threads)
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Athlon X4 530 28 nm KB-A1 4 (4) 2.00 32 KB inst.
32 KB data

per core
2 MB 1600
single-channel
25 AD530XJAH44HM
Athlon X4 550 2.20 AD550XJAH44HM
Sempron 2650 Apr 9, 2014 2 (2) 1.45 1 MB R3 (HD 8240) 128:8:4
2 CU
400 102.4 1333
single-channel
SD2650JAHMBOX SD2650JAH23HM
Sempron 3850 4 (4) 1.30 2 MB R3 (HD 8280) 450 115.2 1600
single-channel
SD3850JAHMBOX SD3850JAH44HM
Athlon 5150 1.60 R3 (HD 8400) 600 153.6 AD5150JAHMBOX AD5150JAH44HM
Athlon 5350 2.05 AD5350JAHMBOX AD5350JAH44HM
Athlon 5370 Feb 2016 2.20 AD5370JAH44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kaveri" (2014) & "Godavari" (2015)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Athlon X2 450[38] Jul 31, 2014 28 nm KV-A1 [1]2 3.5 3.9 96 KB inst.
per module

16 KB data
per core
1 MB 1866 65 AD450XYBI23JA
Athlon X4 830 2018 [2]4 3.0 3.4 2×2 MB 2133 AD830XYBI44JA
Athlon X4 840[38] Aug 2014 3.1 3.8 AD840XYBJABOX AD840XYBI44JA
Athlon X4 850 2015 GV-A1 3.2 AD835XACI43KA
Athlon X4 860K Aug 2014 KV-A1 3.7 4.0 95 AD860KXBJABOX
AD860KWOHLBOX
AD860KXBJASBX
AD860KXBI44JA
Athlon X4 870K Dec 2015 GV-A1 3.9 4.1 AD870KXBJCSBX AD870KXBI44JC
Athlon X4 880K Mar 1, 2016 4.0 4.2 AD880KXBJCSBX
FX-770K[50] Dec 2014 KV-A1 3.5 3.9 65 FD770KYBI44JA
A4 Pro-7350B Jul 31, 2014 [1]2 3.4 3.8 1 MB R5 192:12:8
3 CU
514 197.3 1866 AD735BYBI23JA
Pro A4-8350B Sep 29, 2015 3.5 3.9 256:16:8
4 CU
757 387.5 AD835BYBI23JC
A6-7400K Jul 31, 2014 3.5 3.9 756 387 AD740KYBJABOX AD740KYBI23JA
A6 Pro-7400B AD740BYBI23JA
A6-7470K Feb 2, 2016 GV-A1 3.7 4.0 800 409.6 2133 AD747KYBJCBOX AD747KYBI23JC
Pro A6-8550B Sep 29, 2015 AD855BYBI23JC
A8-7500[51][52] 2014 KV-A1 [2]4 3.0 3.7 2×2 MB R7 384:24:8
6 CU
720 552.9 AD7500YBI44JA
A8-7600 Jul 31, 2014 3.1 3.8 AD7600YBJABOX AD7600YBI44JA
A8 Pro-7600B AD760BYBI44JA
A8-7650K Jan 7, 2015 3.3 95 AD765KXBJABOX
AD765KXBJASBX
AD765KXBI44JA
A8-7670K Jul 20, 2015 GV-A1 3.6 3.9 757 581.3 AD767KXBJCSBX
AD767KXBJCBOX
AD767KXBI44JC
Pro A8-8650B Sep 29, 2015 3.2 65 AD865BYBI44JC
A10-7700K Jan 14, 2014 KV-A1 3.4 3.8 720 552.9 95 AD770KXBJABOX AD770KXBI44JA
A10-7800 Jul 31, 2014 3.5 3.9 512:32:8
8 CU
737.2 65 AD7800YBJABOX AD7800YBI44JA
A10 Pro-7800B AD780BYBI44JA
A10-7850K Jan 14, 2014 3.7 4.0 95 AD785KXBJABOX AD785KXBI44JA
A10 Pro-7850B Jul 31, 2014 AD785BXBI44JA
A10-7860K Feb 2, 2016 GV-A1 3.6 757 775.1 65 AD786KYBJABOX
AD786KYBJCSBX
AD786KYBI44JC
A10-7870K May 28, 2015 3.9 4.1 866 886.7 95 AD787KXDJCBOX
AD787KXDJCSBX
AD787KXDI44JC
A10-7890K Mar 1, 2016 4.1 4.3 AD789KXDJCHBX AD789KXDI44JC
Pro A10-8750B Sep 29, 2015 3.6 4.0 757 775.1 65 AD875BYBI44JC
Pro A10-8850B 3.9 4.1 800 819.2 95 AD885BXBI44JC
Model Released Fab Step. [Modules/FPUs]
Cores/threads
Base Boost L1 L2 Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
DDR3
memory
support
TDP
(W)
Box number Part number
Clock rate (GHz) Cache[a]
CPU GPU
  1. ^ a b AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ a b Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Carrizo" (2016)[edit]

Model Released Fab Step. Socket CPU GPU Memory
support
TDP
(W)
Box number[a] Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[b] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[c]
Base Boost L1 L2
Athlon X4 835 28 nm CZ-A1 FM2+ [2]4 3.1 96 KB inst.
per module

32 KB data
per core
2×1 MB DDR3-2133 65 AD835XACI43KA
Athlon X4 845 Feb 2, 2016 3.5 3.8 AD845XYBJCSBX
AD845XACKASBX
AD845XACI43KA
A6-7480[54] Oct 2018 [1]2 1 MB R5 384:24:8
6 CU
900 691.2 AD7480ACABBOX AD7480ACI23AB
A8-7680[55] [2]4 2×1 MB R7 AD7680ACABBOX AD7680ACI43AB
Pro A6-8570E Oct 2016 AM4 [1]2 3.0 3.4 1 MB R5 256:16:4
4 CU
800 409.6 DDR4-2400 35 AD857BAHM23AB
Pro A6-8570 3.5 3.8 384:24:6
6 CU
1029 790.2 65 AD857BAGM23AB
Pro A10-8770E [2]4 2.8 3.5 2×1 MB R7 847 650.4 35 AD877BAHM44AB
Pro A10-8770 3.5 3.8 1029 790.2 65 AD877BAGM44AB
Pro A12-8870E 2.9 512:32:8
8 CU
900 921.6 35 AD887BAHM44AB
Pro A12-8870 3.7 4.2 1108 1134.5 65 AD887BAUM44AB
  1. ^ With cooler if available.
  2. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bristol Ridge" (2016)[edit]

Model Released Fab Step. CPU GPU DDR4
memory
support
TDP
(W)
Box number[a] Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[b] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[c]
Base Boost L1 L2
Athlon X4 940[57] Jul 27, 2017 28 nm BR-A1 [2]4 3.2 3.6 96 KB inst.
per module

32 KB data
per core
2×1 MB 2400 65 AD940XAGABBOX AD940XAGM44AB
Athlon X4 950[58] 3.5 3.8 AD950XAGABBOX AD950XAGM44AB
Athlon X4 970[59] 3.8 4.0 AD970XAUABBOX AD970XAUM44AB
A6-9400[60] Mar 16, 2019 [1]2 3.4 3.7 1 MB R5 192:12:4
3 CU
720 276.4 AD9400AGABBOX AD9400AGM23AB
A6-9500E[61] Sep 5, 2016 3.0 3.4 256:16:4
4 CU
800 409.6 35 AD9500AHABBOX AD9500AHM23AB
Pro A6-9500E[62] Oct 3, 2016 AD950BAHM23AB
A6-9500[63] Sep 5, 2016 3.5 3.8 384:24:6
6 CU
1029 790.2 65 AD9500AGABBOX AD9500AGM23AB
Pro A6-9500[64] Oct 3, 2016 AD950BAGM23AB
A6-9550[65] Jul 27, 2017 3.8 4.0 256:16:4
4 CU
800 409.6 AD9550AGABBOX AD9550AGM23AB
A8-9600[66] Sep 5, 2016 [2]4 3.1 3.4 2×1 MB R7 384:24:6
6 CU
900 691.2 AD9600AGABBOX AD9600AGM44AB
Pro A8-9600[67] Oct 3, 2016 AD960BAGM44AB
A10-9700E[68] Sep 5, 2016 3.0 3.5 847 650.4 35 AD9700AHABBOX AD9700AHM44AB
Pro A10-9700E[69] Oct 3, 2016 AD970BAHM44AB
A10-9700[70] Sep 5, 2016 3.5 3.8 1029 790.2 65 AD9700AGABBOX AD9700AGM44AB
Pro A10-9700[71] Oct 3, 2016 AD970BAGM44AB
A12-9800E[72] Sep 5, 2016 3.1 3.8 512:32:8[73]
8 CU
900 921.6 35 AD9800AHABBOX AD9800AUM44AB
Pro A12-9800E[74] Oct 3, 2016 AD980BAHM44AB
A12-9800[75] Sep 5, 2016 3.8 4.2 1108 1134.5 65 AD9800AUABBOX AD9800AUM44AB
Pro A12-9800[76] Oct 3, 2016 AD980BAUM44AB
  1. ^ With cooler if available.
  2. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Raven Ridge" (2018)[edit]

Common features of Zen based Raven Ridge desktop APUs:

Model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model Config[i] Clock
(MHz)
Processing
power
(GFLOPS)[ii]
Base Boost
Athlon 200GE 2 (4) 3.2 4 MB Vega 3 192:12:4
3 CU
1000 384 35 W Sep 6, 2018 US $55[77]
Athlon Pro 200GE OEM
Athlon 220GE 3.4 Dec 21, 2018 US $65[78]
Athlon 240GE 3.5 US $75[78]
Athlon 300GE 3.4 1100 424.4 Jul 7, 2019 OEM
Athlon Pro 300GE Sep 30, 2019
Athlon 320GE 3.5 Jul 7, 2019
Athlon 3000G Nov 19, 2019 US $49[79]
Athlon Silver 3050GE 3.4 Jul 21, 2020 OEM
Ryzen 3 Pro 2100GE[80] 3.2 1000 384 2019
Ryzen 3 2200GE 4 (4) 3.6 Vega 8 512:32:16
8 CU
1100 1126 Apr 19, 2018
Ryzen 3 Pro 2200GE May 10, 2018
Ryzen 3 2200G 3.5 3.7 65 W Feb 12, 2018 US $99[81]
Ryzen 3 Pro 2200G May 10, 2018 OEM
Ryzen 5 2400GE 4 (8) 3.2 3.8 RX Vega 11 704:44:16
11 CU
1250 1760 35 W Apr 19, 2018
Ryzen 5 Pro 2400GE Vega 11 May 10, 2018
Ryzen 5 2400G 3.6 3.9 RX Vega 11 65 W Feb 12, 2018 US $169[81]
Ryzen 5 Pro 2400G Vega 11 May 10, 2018 OEM
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)[edit]

Common features of Zen+ based desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2933 in dual-channel mode, while Athlon Pro 300GE and Athlon Silver Pro 3125GE support only DDR4-2666.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: GlobalFoundries 12LP.
Model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model[i] Config[ii] Clock
(MHz)
Processing
power
(GFLOPS)[iii]
Base Boost
Athlon Pro 300GE 2 (4) 3.4 4 MB Vega 3 192:12:4
3 CU
1100 424.4 35 W Sep 30, 2019 OEM
Athlon Silver Pro 3125GE Radeon
Graphics
Jul 21, 2020
Athlon Gold 3150GE 4 (4) 3.3 3.8
Athlon Gold Pro 3150GE
Athlon Gold 3150G 3.5 3.9 65 W
Athlon Gold Pro 3150G
Ryzen 3 3200GE 3.3 3.8 Vega 8 512:32:16
8 CU
1200 1228.8 35 W Jul 7, 2019
Ryzen 3 Pro 3200GE Sep 30, 2019
Ryzen 3 3200G 3.6 4.0 1250 1280 65 W Jul 7, 2019 US $99[85]
Ryzen 3 Pro 3200G Sep 30, 2019 OEM
Ryzen 5 Pro 3350GE 3.3 3.9 Radeon
Graphics
640:40:16
10 CU
1200 1536 35 W Jul 21, 2020
Ryzen 5 Pro 3350G 4 (8) 3.6 4.0 1300 1830.4 65 W
Ryzen 5 3400GE 3.3 Vega 11 704:44:16
11 CU
35 W Jul 7, 2019
Ryzen 5 Pro 3400GE Sep 30, 2019
Ryzen 5 3400G 3.7 4.2 RX Vega 11 1400 1971.2 65 W Jul 7, 2019 US $149[85]
Ryzen 5 Pro 3400G Vega 11 Sep 30, 2019 OEM
  1. ^ Starting with 2020 releases, AMD stopped referring to integrated graphics as "Vega", therefore all Vega based iGPUs are branded as AMD Radeon Graphics (instead Radeon Vega 3 or Radeon Vega 10).[82][83][84]
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Renoir" (2020)[edit]

Common features of Ryzen 4000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
Config[i]
Model Clock
(GHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 4700G[a] 8 (16) 3.6 4.4 8 MB 2 × 4 Radeon
Graphics[b]
2.1 512:32:16
8 CU
2150.4 65 W Jul 21, 2020 OEM
4700GE[a] 3.1 4.3 2.0 2048 35 W
Ryzen 5 4600G[a][86] 6 (12) 3.7 4.2 2 × 3 1.9 448:28:14
7 CU
1702.4 65 W Jul 21, 2020
(OEM) /
Apr 4, 2022
(retail)
OEM /
US $154
4600GE[a] 3.3 35 W Jul 21, 2020 OEM
Ryzen 3 4300G[a] 4 (8) 3.8 4.0 4 MB 1 × 4 1.7 384:24:12
6 CU
1305.6 65 W
4300GE[a] 3.5 35 W
  1. ^ Core complexes (CCXs) × cores per CCX
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93]
  2. ^ All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)[edit]

Common features of Ryzen 5000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU[a] Thermal
solution
TDP Release
date
MSRP
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Clock
(MHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 5700G[b] 8 (16) 3.8 4.6 16 MB 1 × 8 2000 512:32:8
8 CU
2048 Wraith Stealth 65 W Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $359
5700GE[b] 3.2 35 W Apr 13, 2021 OEM
Ryzen 5 5600GT 6 (12) 3.6 1 × 6 1900 448:28:8
7 CU
1702.4 65 W Jan 31, 2024[94] US $140
5600G[b] 3.9 4.4 Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $259
5600GE[b] 3.4 35 W Apr 13, 2021 OEM
5500GT 3.6 65 W Jan 31, 2024[94] US $125
Ryzen 3 5300G[b] 4 (8) 4.0 4.2 8 MB 1 × 4 1700 384:24:8
6 CU
1305.6 OEM Apr 13, 2021 OEM
5300GE[b] 3.6 35 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b c d e f Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101]

Non APU or Radeon Graphics branded[edit]

"Raphael" (2022)[edit]

Common features of Ryzen 7000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i]. Models with "F" suffixes are without iGPUs.
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Branding and model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Thermal
solution
Chiplets Core
config[ii]
TDP Release
date
MSRP
Base Boost
Ryzen 9 7950X3D 16 (32) 4.2 5.7 128 MB[iii] 2 × CCD
1 × I/OD
2 × 8 120 W Feb 28, 2023 US $699
7950X 4.5 64 MB 170 W Sep 27, 2022
7900X3D 12 (24) 4.4 5.6 128 MB[iii] 2 × 6 120 W Feb 28, 2023 US $599
7900X 4.7 64 MB 170 W Sep 27, 2022 US $549
7900 3.7 5.4 Wraith Prism 65 W Jan 10, 2023 US $429[104]
PRO 7945 Wraith Spire Jun 13, 2023 OEM
Ryzen 7 7800X3D 8 (16) 4.2 5.0 96 MB 1 × CCD
1 × I/OD
1 × 8 120 W Apr 6, 2023 US $449
7700X 4.5 5.4 32 MB 105 W Sep 27, 2022 US $399
7700 3.8 5.3 Wraith Prism 65 W Jan 10, 2023 US $329[104]
PRO 7745 Wraith Spire Jun 13, 2023 OEM
Ryzen 5 7600X 6 (12) 4.7 1 × 6 105 W Sep 27, 2022 US $299
7600 3.8 5.1 Wraith Stealth 65 W Jan 10, 2023 US $229[104]
PRO 7645 Wraith Spire Jun 13, 2023 OEM
7500F 3.7 5.0 Wraith Stealth Jul 22, 2023 US $179[105]
  1. ^ Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Core Complexes (CCX) × cores per CCX
  3. ^ a b Only one of the two CCXes has additional 64 MB 3D V-Cache.[102] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[103]

Server APUs[edit]

Opteron X2100-series "Kyoto" (2013) & "Steppe Eagle" (2016)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Part number Release
price
(USD)
Cores
(threads)
Clock
(GHz)
Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
L1 L2
X1150[106] May 29, 2013[107] 28 nm 4 (4) 2.0 32 KB inst.
32 KB data

per core
2 MB 1600 9–17 OX1150IPJ44HM $64
X2150 1.9 R3 (HD 8400) 128:8:4
2 CU
266–600 28.9 11–22 OX2150IAJ44HM $99
X2170 Sep 1, 2016 2.4 R5 655–800 153.6 1866 11–25 OX2170IXJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Opteron X3000-series "Toronto" (2017)[edit]

Model Released Fab Step. CPU GPU DDR4
memory
support
TDP
(W)
Part number Release
price
(USD)
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
X3216[109][110] June 2017 28 nm 01h [1]2 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 MB R5 256:16:4
4 CU
800 409.6 1600 12–15 OX3216AAY23KA OEM for HP
X3418[109][111] [2]4 1.8 3.2 2 MB R6 384:24:6
6 CU
614.4 2400 12–35 OX3418AAY43KA
X3421[109][112] June 2017 2.1 3.4 R7 512:32:8
8 CU
819.2 OX3421AAY43KA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Mobile processors with 3D graphics[edit]

APU or Radeon Graphics branded[edit]

Sabine: "Llano" (2011)[edit]

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FS1
  • Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die
  • L1 Cache: 64 KB Data per core and 64 KB Instructions per core(BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
  • Integrated PCIe 2.0 controller
  • GPU: TeraScale 2
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
  • 2.5 GT/s UMI
  • MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • PowerNow!
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2 L3
E2-3000M 2011

6/14

32 nm B0 2 (2) 1.8 2.4 64 KB inst.
64 KB data

per core
2× 512KB HD 6380G 160:8:4 400 128 1333 35 EM3000DDX22GX
A4-3300M 2011

6/14

1.9 2.5 2× 1MB HD 6480G 240:12:4 444 213.1 35 AM3300DDX23GX
A4-3305M December 7, 2011 2× 512KB 160:8:4 593 189.7 AM3305DDX22GX
A4-3310MX 2011

6/14

2.1 2× 1MB 240:12:4 444 213.1 45 AM3310HLX23GX
A4-3320M December 7, 2011 2.0 2.6 35 AM3320DDX23GX
A4-3330MX 2.2 45 AM3330HLX23GX
A4-3330MX 2.3 2× 512KB 160:8:4 593 189.7 AM3330HLX23HX
A6-3400M 2011

6/14

4 (4) 1.4 2.3 4× 1MB HD 6520G 320:16:8 400 256 35 AM3400DDX43GX
A6-3410MX 1.6 1600 45 AM3410HLX43GX
A6-3420M December 7, 2011 1.5 2.4 1333 35 AM3420DDX43GX
A6-3430MX 1.7 1600 45 AM3430HLX43GX
A8-3500M 2011

6/14

1.5 2.4 HD 6620G 400:20:8 444 355.2 1333 35 AM3500DDX43GX
A8-3510MX 1.8 2.5 1600 45 AM3510HLX43GX
A8-3520M December 7, 2011 1.6 1333 35 AM3520DDX43GX
A8-3530MX 2011

6/14

1.9 2.6 1600 45 AM3530HLX43GX
A8-3550MX December 7, 2011 2.0 2.7 AM3550HLX43GX
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Comal: "Trinity" (2012)[edit]

An AMD A10-4600M APU
Model number Released Fab Step. Socket CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A4-4355M September 27, 2012 32 nm TN-A1 FP2 [1]2 1.9 2.4 64 KB inst.
per module

16 KB data
per core
1 HD 7400G 192:12:4
3 CU
327 424 125.5 1333 17 AM4355SHE23HJ
A6-4455M May 15, 2012 2.1 2.8 2 HD 7500G 256:16:8
4 CU
167.4 AM4455SHE24HJ
A8-4555M September 27, 2012 [2]4 1.6 2.4

2MB

HD 7600G 384:24:8
6 CU
320 245.7 19 AM4555SHE44HJ
A8-4557M[113] Mar

2013

1.9 2.8 HD 7000 256:16:8
4 CU
497 655 254.4 (L)1600 35 AM4557DFE44HJ
A10-4655M May 15, 2012 2.0 2.8 HD 7620G 384:24:8
6 CU
360 496 276.4 1333 25 AM4655SIE44HJ
A10-4657M[113] Mar

2013

2.3 3.2 HD 7000 497 686 381.6 (L)1600 35 AM4657DFE44HJ
A4-4300M May 15, 2012 FS1r2 [1]2 2.5 3.0 1 HD 7420G 128:8:4
2 CU
480 655 122.8 1600 AM4300DEC23HJ
A6-4400M 2.7 3.2 HD 7520G 192:12:4
3 CU
496 685 190.4 AM4400DEC23HJ
A8-4500M [2]4 1.9 2.8

2MB

HD 7640G 256:16:8
4 CU
253.9 AM4500DEC44HJ
A10-4600M 2.3 3.2 HD 7660G 384:24:8
6 CU
380.9 AM4600DEC44HJ
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

"Richland" (2013)[edit]

Model number Released Fab Step. Socket CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A4-5145M 2013/5 32 nm RL-A1 FP2 [1]2 2.0 2.6 64 KB inst.
per module

16 KB data
per core
1 HD 8310G 128:8:4
2 CU
424 554 108.5 (L)1333 17 AM5145SIE44HL
A6-5345M 2.2 2.8 HD 8410G 192:12:4
3 CU
450 600 172.8 AM5345SIE44HL
A8-5545M [2]4 1.7 2.7 4 HD 8510G 384:28:8
6 CU
554 345.6 19 AM5545SIE44HL
A10-5745M 2.1 2.9 HD 8610G 533 626 409.3 25 AM5745SIE44HL
A4-5150M 2013 Q1 FS1r2 [1]2 2.7 3.3 1 HD 8350G 128:8:4
2 CU
533 720 136.4 1600 35 AM5150DEC23HL
A6-5350M 2.9 3.5 HD 8450G 192:12:4
3 CU
204.6 AM5350DEC23HL
A6-5357M 2013/5 FP2 (L)1600 AM5357DFE23HL
A8-5550M 2013 Q1 FS1r2 [2]4 2.1 3.1 4 HD 8550G 256:16:8
4 CU
515 263.6 1600 AM5550DEC44HL
A8-5557M 2013/5 FP2 554 283.6 (L)1600 AM5557DFE44HL
A10-5750M 2013 Q1 FS1r2 2.5 3.5 HD 8650G 384:24:8
6 CU
533 409.3 1866 AM5750DEC44HL
A10-5757M 2013/5 FP2 600 460.8 (L)1600 AM5757DFE44HL
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

"Kaveri" (2014)[edit]

Model number Released Fab CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A6-7000 June 2014 28 nm [1]2 2.2 3.0 96 KB inst.
per module

16 KB data
per core
1 R4 192:12:3
3 CU
494 533 189.6 1333 17 AM7000ECH23JA
A6 PRO - 7050B 533 204.6 1600 AM705BECH23JA
A8-7100 [2]4 1.8 3.0 2× 2 MB R5 256:16:4
4 CU
450 514 230.4 1600 20 AM7100ECH44JA
A8 PRO - 7150B 1.9 3.2 553 283.1 AM715BECH44JA
A10-7300 R6 384:24:8
6 CU
464 533 356.3 AM7300ECH44JA
A10 PRO - 7350B 2.1 3.3 533 424.7 AM735BECH44JA
FX-7500 R7 498 553 382.4 FM7500ECH44JA
A8-7200P 2.4 3.3 R5 256:16:4
4 CU
553 626 283.1 1866 35 AM740PDGH44JA
A10-7400P 2.5 3.4 R6 384:24:8
6 CU
576 654 442.3 AM740PDGH44JA
FX-7600P 2.7 3.6 R7 512:32:8
8 CU
600 686 614.4 2133 FM760PDGH44JA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Carrizo" (2015)[edit]

Model number Released Fab CPU GPU DDR

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

A6-8500P June 2015 28 nm [1]2 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 R5 256:16:4
4 CU
800 409.6 3)1600 12-

35

AM850PAAY23KA
PRO A6-8500B AM850BAAY23KA
PRO A6-8530B Q3 2016 2.3 3.2 4)1866 AM853BADY23AB
A8-8600P June 2015 [2]4 1.6 3.0

1MB

R6 384:24:8
6 CU
720 552.9 3)2133 AM860PAAY43KA
PRO A8-8600B AM860BAAY43KA
A10-8700P 1.8 3.2 800 614.4 AM870PAAY43KA
PRO A10-8700B AM870BAAY43KA
PRO A10-8730B Q3 2016 2.4 3.3 R5 720 552.9 4)1866 AM873BADY44AB
A10-8780P December 2015 2.0 3.3 R8 512:32:8
8 CU
3)? AM878PAIY43KA
FX-8800P June 2015 2.1 3.4 R7 800 819.2 4)2133 FM880PAAY43KA
PRO A12-8800B FM880BAAY43KA
PRO A12-8830B Q3 2016 2.5 3.4 384:24:8
6 CU
758 582.1 4)1866 AM883BADY44AB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bristol Ridge" (2016)[edit]

Model number Released Fab CPU GPU DDR4

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

Pro A6-9500B October 24, 2016 28nm [1]2 2.3 3.2 96 KB inst.
per module

32 KB data
per core
1 R5 256:16:4
4 CU
800 409.6 1866 12-

15

Pro A8-9600B October 24, 2016 [2]4 2.4 3.3 2× 1 MB R5 384:24:6
6 CU
720 552.9 1866 12–

15

A10-9600P June 2016 AM960PADY44AB
A10-9620P[118] 2017 (OEM) 2.5 3.4 758 582.1
Pro A10-9700B October 24, 2016 R7
A12-9700P June 2016 AM970PADY44AB
Pro A8-9630B October 24, 2016 2.6 3.3 R5 800 614.4 2400 25–

45

A10-9630P June 2016 AM963PAEY44AB
Pro A10-9730B October 24, 2016 2.8 3.5 R7 900 691.2
A12-9730P June 2016 AM973PAEY44AB
Pro A12-9800B October 24, 2016 2.7 3.6 R7 512:32:8
8 CU
758 776.1 1866 12–

15

[1] FX-9800P
A12-9720P[119][120]
June 2016
2017 (OEM)
FM980PADY44AB
?
Pro A12-9830B October 24, 2016 3.0 3.7 900 921.6 2400 25–

45

FX-9830P June 2016 FM983PAEY44AB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Raven Ridge" (2017)[edit]

Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(MHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
Athlon Pro 200U 2019 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Radeon Vega 3 192:12:4
3 CU
1000 384 FP5 12 (8+4) DDR4-2400
dual-channel
12–25 W
Athlon 300U Jan 6, 2019 2.4 3.3
Ryzen 3 2200U Jan 8, 2018 2.5 3.4 1100 422.4
Ryzen 3 3200U Jan 6, 2019 2.6 3.5 1200 460.8
Ryzen 3 2300U Jan 8, 2018 4 (4) 2.0 3.4 Radeon Vega 6 384:24:8
6 CU
1100 844.8
Ryzen 3 Pro 2300U May 15, 2018
Ryzen 5 2500U Oct 26, 2017 4 (8) 3.6 Radeon Vega 8 512:32:16
8 CU
1126.4
Ryzen 5 Pro 2500U May 15, 2018
Ryzen 5 2600H Sep 10, 2018 3.2 DDR4-3200
dual-channel
35–54 W
Ryzen 7 2700U Oct 26, 2017 2.2 3.8 Radeon RX Vega 10 640:40:16
10 CU
1300 1664 DDR4-2400
dual-channel
12–25 W
Ryzen 7 Pro 2700U May 15, 2018 Radeon Vega 10
Ryzen 7 2800H Sep 10, 2018 3.3 Radeon RX Vega 11 704:44:16
11 CU
1830.4 DDR4-3200
dual-channel
35–54 W
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)[edit]

Common features of Ryzen 3000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 3780U[121] 4 (8) 2.3 4.0 4 MB 1 × 4 RX Vega 11 1.4 704:44:16
11 CU
1971.2 15 W Oct 2019
3750H[122] RX Vega 10 640:40:16
10 CU[123]
1792.0 35 W Jan 6, 2019
3700C[124] 15 W Sep 22, 2020
3700U[a][125] Jan 6, 2019
Ryzen 5 3580U[126] 2.1 3.7 Vega 9 1.3 576:36:16
9 CU
1497.6 Oct 2019
3550H[127] Vega 8 1.2 512:32:16
8 CU[128]
1228.8 35 W Jan 6, 2019
3500C[129] 15 W Sep 22, 2020
3500U[a][130] Jan 6, 2019
3450U[131] 3.5 Jun 2020
Ryzen 3 3350U[132] 4 (4) Vega 6 384:24:8
6 CU[133]
921.6 Jan 6, 2019
3300U[a][134]
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[135][136][137], released April 8, 2019.

"Renoir" (2020)[edit]

  • Fabrication 7 nm by TSMC[138][139][140]
  • Socket FP6
  • Die size: 156 mm²
  • 9.8 billion transistors on one single 7 nm monolithic die[141]
  • Up to eight Zen 2 CPU cores
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fifth generation GCN-based GPU
  • Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • All the CPUs support 16 PCIe 3.0 lanes.
U[edit]
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(MHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 4980U 8 (16) 2.0 4.4 8 MB 2 × 4 Radeon
Graphics[a]
1950 512:32:8
8 CU
1996.8 15 W Apr 13, 2021
4800U 1.8 4.2 1750 1792 Mar 16, 2020
Pro 4750U 1.7 4.1 1600 448:28:8
7 CU
1433.6 May 7, 2020
4700U 8 (8) 2.0 Mar 16, 2020
Ryzen 5 4680U 6 (12) 2.1 4.0 2 × 3 1500 1344 Apr 13, 2021
Pro 4650U 384:24:8
6 CU
1152 May 7, 2020
4600U Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 Pro 4450U 4 (8) 2.5 3.7 4 MB 1 × 4 1400 320:20:8
5 CU
896 May 7, 2020
4300U 4 (4) 2.7 Mar 16, 2020
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
H[edit]
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(MHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics[a]
1750 512:32:8
8 CU
1792 45 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H 2.9 4.2 1600 448:28:8
7 CU
1433.6 45 W
4800HS
Ryzen 5 4600H 6 (12) 3.0 4.0 2 × 3 1500 384:24:8
6 CU
1152
4600HS[142][143][144] 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Lucienne" (2021)[edit]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 156 mm²
  • 9.8 billion transistors on one single 7 nm monolithic die[citation needed]
  • Up to eight Zen 2 CPU cores
  • Fifth generation GCN-based GPU (7 nm Vega)

Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB 2 × 4 Radeon
Graphics
[a]
1.9 512:32:8
8 CU
1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[145] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU
1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU
1152
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)[edit]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 180 mm²
  • Up to eight Zen 3 CPU cores
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fifth generation GCN-based GPU
  • Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • All the CPUs support 16 PCIe 3.0 lanes.
U[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5800U[note 1][146] 8 (16) 1.9 4.4 16 MB 1 × 8 Radeon
Graphics[a]
2.0 512:32:8
8 CUs
2048 10–25 W Jan 12, 2021
Ryzen 5 5600U[note 1][147] 6 (12) 2.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8
5560U[148] 4.0 8 MB 1.6 384:24:8
6 CUs
1228.8
Ryzen 3 5400U[note 1][149][150] 4 (8) 2.7 4.1 1 × 4
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d Model also available as Pro version as 5450U,[151] 5650U,[152] 5850U,[153] released on March 16, 2021.
H[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 5980HX[154] 8 (16) 3.3 4.8 16 MB 1 × 8 Radeon
Graphics[a]
2.1 512:32:8
8 CUs
2150.4 35–54 W Jan 12, 2021
5980HS[155] 3.0 35 W
5900HX[156] 3.3 4.6 35–54 W
5900HS[157] 3.0 35 W
Ryzen 7 5800H[158][159] 3.2 4.4 2.0 2048 35–54 W
5800HS[160] 2.8 35 W
Ryzen 5 5600H[161][162] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8 35–54 W
5600HS[163] 3.0 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Barceló" (2022)[edit]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 180 mm²
  • Up to eight Zen 3 CPU cores
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fifth generation GCN-based GPU
  • Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • All the CPUs support 16 PCIe 3.0 lanes.
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5825U[note 1][note 2][164] 8 (16) 2.0 4.5 16 MB 1 × 8 Radeon
Graphics[a]
2.0 512:32:8
8 CUs
2048 15 W Jan 4, 2022
Ryzen 5 5625U[note 1][note 2][165] 6 (12) 2.3 4.3 1 × 6 1.8 448:28:8
7 CUs
1612.8
Ryzen 3 5125C[166] 2 (4) 3.0 8 MB 1 × 2 ? 192:12:8
3 CU
? May 5, 2022
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as Pro version as 5475U,[167] 5675U,[168] 5875U,[169] released on April 19, 2022.
  2. ^ a b c Model also available as Chromebook optimized version as 5425C,[170] 5625C,[171] 5825C,[172] released on May 5, 2022.

"Rembrandt" (2022)[edit]

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC 6 nm FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs
3686.4 45 W Jan 4, 2022
[173]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs
1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[174], 6650H[175], 6650HS[176], 6850U[177], 6850H[178], 6850HS[179], 6950H[180], 6950HS[181]), released on April 19, 2022.

"Phoenix" (2023)[edit]

"Dragon Range" (2023)[edit]

Ultra-mobile APUs[edit]

Brazos: "Desna", "Ontario", "Zacate" (2011)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2
Z-01 June 1, 2011 40 nm B0 2 (2) 1.0 32KB inst.
32KB data

per core
2× 512KB HD 6250 80:8:4 276 44.1 1066 5.9 XMZ01AFVB22GV
C-30 January 4, 2011 1 (1) 1.2 512KB 9 CMC30AFPB12GT
C-50 2 (2) 1.0 2× 512KB CMC50AFPB22GT
C-60 August 22, 2011 C0 1.33 HD 6290 400 CMC60AFPB22GV
E-240 January 4, 2011 B0 1 (1) 1.5 512KB HD 6310 500 80 1066 18 EME240GBB12GT
E-300 August 22, 2011 2 (2) 1.3

512KB

488 78 EME300GBB22GV
E-350 January 4, 2011 1.6 492 78.7 EME350GBB22GT
E-450 August 22, 2011 B0
C0
1.65 HD 6320 508 600 81.2 1333 EME450GBB22GV
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Brazos 2.0: "Ontario", "Zacate" (2012)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2 L3
C-70 September 15, 2012 40 nm C0 2 (2) 1.0 1.33 32 KB inst.
32 KB data

per core
2× 512KB HD 7290 80:8:4 276 400 44.1 1066 9 CMC70AFPB22GV
E1-1200 June 6, 2012 C0 1.4 HD 7310 500 80 1066 18 EM1200GBB22GV
E1-1500 January 7, 2013 1.48 529 84.6
E2-1800 June 6, 2012 1.7 HD 7340 523 680 83.6 1333 EM1800GBB22GV
E2-2000 January 7, 2013 1.75 538 700 86
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Brazos-T: "Hondo" (2012)[edit]

Model Released Fab Step. CPU GPU DDR3
Memory
support
TDP (W) Part number
Cores
(threads)
Clock (GHz) Cache[a] Model Config Clock (MHz) GFLOPS[b]
L1 L2
Z-60 October 9, 2012 40 nm C0 2 (2) 1.0 32KB inst.
32KB data

per core
2× 512 KB HD 6250 80:8:4 276 44.1 1066 4.5 XMZ60AFVB22GV
  1. ^ AMD in its technical documentation uses KB, which it defines as "kilobyte" and as equal to 1024 B (i.e., 1 KiB), and MB, which it defines as "megabyte" and as equal to 1024 KB (1 MiB).[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini", "Temash" (2013)[edit]

Temash, Elite Mobility APU[edit]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

L1 L2

(MB)

A4-1200 May 23, 2013 28 nm KB-A1 2 (2) 1.0 32 KB inst.
32 KB data

per core
1 HD 8180 128:8:4
2 CU
225 1066 4 AT1200IFJ23HM
A4-1250 HD 8210 300 1333 8 AT1250IDJ23HM
A4-1350 4 (4) 2 1066 AT1350IDJ44HM
A6-1450 1.4 HD 8250 400 AT1450IDJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

Kabini, Mainstream APU[edit]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

L1 L2

(MB)

L3
E1-2100 May 2013 28 nm KB-A1 2 (2) 1.0 32KB inst.
32KB data

per core
1 HD 8210 128:8:4
2 CU
300 1333 9 EM2100ICJ23HM
E1-2200 Feb 2014 1.05 EM2200ICJ23HM
E1-2500 May 2013 1.4 HD 8240 400 15 EM2500IBJ23HM
E2-3000 1.65 HD 8280 450 1600 EM3000IBJ23HM
E2-3800 Feb 2014 4 1.3 2 EM3800IBJ44HM
A4-5000 May 2013 1.5 HD 8330 497 AM5000IBJ44HM
A4-5100 Feb 2014 1.55 AM5100IBJ44HM
A6-5200 May 2013 2.0 HD 8400 600 25 AM5200IAJ44HM
A4 Pro-3340B Nov 2014 2.2 HD 8240 400 AM334BIAJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

"Beema", "Mullins" (2014)[edit]

Mullins, Tablet/2-in-1 APU[edit]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

L1 L2

(MB)

L3
E1 Micro-6200T Q2 2014 28 nm ML-A1 2 (2) 1.0 1.4 32 KB inst.
32 KB data

per core
1 R2 128:8:4
2 CU
300 600 1066 3.95 EM620TIWJ23JB
A4 Micro-6400T 4 (4) 1.6 2 R3 350 686 1333 4.5 AM640TIVJ44JB
A10 Micro-6700T 1.2 2.2 R6 500 AM670TIVJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

Beema, Notebook APU[edit]

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Model Released Fab Step. CPU GPU DDR3 Memory support TDP (W) Part number
Cores (threads) [FPUs] Clock (GHz) Turbo (GHz) Cache[a] Model Config Clock (MHz) Turbo (MHz)
L1 L2 (MB) L3
E1-6010 Q2 2014 28 nm ML-A1 2 (2) 1.35 32 KB inst. 32 KB data per core 1 R2 128:8:4
2 CU